Mount Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM8S e tsitsitseng haholo
Melemo ea DO-218AB SM8S:
1. Ka lebaka la theknoloji ea Chemical Etching Method, liphello tse mpe tsa mekhoa ea ho itšeha ka ho toba li felisoa.
2. E matla ka ho khutlela morao ka lebaka la chip e kholo ho feta ea balekane.
3. Sekhahla se tlase haholo sa ho hloleha maemong a leholimo le libakeng tse fapaneng
4. E amohetsoe ke maemo a AEC-Q101
5. Mesebetsi ea Diode e ntlafalitsoe, e rua molemo ho ts'ireletso ea saense ho PN junction.
LITŠOANTŠISO TSA MOTHO:
VBR: 11.1 V ho ea ho 52.8 V
VWM: 10 V ho isa ho 43 V
PPPM (10 x 1000 μs): 6600 W
PPPM (10 x 10 000 μs): 5200 W
PD: 8 W
IFSM: 700 A
TJ boholo.: 175 °C
Polarity: Uni-directional
Sephutheloana: DO-218AB
Mekhoa ea Tlhahiso ea Chip
1. Khatiso e Itirisang（Khatiso e hlakileng ea "wafer"
2. Automatic Pele-etching（Thepa ea Automatic Etching, CPK>1.67)
3. Teko e Ikemetseng ea Polarity (Teko e nepahetseng ea Polarity)
4. Kopano e Ikemetseng (Seboka se Iketselitseng Boithaopo)
5. Soldering (Ts'ireletso ka Motsoako oa Nitrogen & Hydrogen
Vacuum soldering)
6. Ho eketsoa ha Bobeli ka ho iketsa (Automatic Second-etching with Ultra-pure Water)
7. Automatic Gluing (Uniform Gluing & Precise Calculation li Lemohuoa ka Automatic Precise Gluing Equipment)
8. Teko e Ikemetseng ea Thermal (Khetho e Ikemetseng ka Thermal Tester)
9. Teko e Ikemetseng (Teko e nang le Multifunctional)
