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Mount Mount Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM5S e tsitsitseng Haholo le e Tšepahalang

Tlhaloso e Khutšoanyane:

Nomoro ea Sehlahisoa.  DO-218ABSM5S 

Selelekela: E tsitsitse Haholo ebile ea TšepahalaSurface Mount PAR® Transient Voltage Suppressors(TVS)DO-218ABSM5S, eo chip ea eona e sebetsoang keMokhoa oa ho Etching oa Lik'hemik'halele PN junction e sirelelitsoe ke sekhomaretsi sa PI ntle le litlamorao tsa ho itšeha khatello ea maikutlo le mapheo a mabe, e na le tšitiso e matla.bokgoni ba ho phahamahammoho le sebaka sa motlakase sa chip e nang le highe otlolohilengho kopanya holim'a sephutheloana sa lead, base le chip.E ka sebetsa ka mokhoa o tloaelehileng tlas'a mocheso oa 175.Mount's Mounting e tsitsitseng haholo ebile e ka tšeptjoaTransient Voltage Suppressor(TVS)DO-218ABSM5S e sebelisoa hotshireletso ya elektronike e hlokolosi kgahlanong le motlakase li-transients tse susumetsoang ke ho feto-fetoha ha moroalo le mabone, haholo bakeng sa ts'ebeliso ea ts'ireletso ea thotobolo ea likoloi.


Lintlha tsa Sehlahisoa

Ho beha leihlo nako ea karabo

Lekhalo la ho lekanya

Li-tag tsa Sehlahisoa

Lintlha tse matla tsa DO-218AB SM5S:

1. The chip ka hare e sebetsoa ke theknoloji e etellang pele lefatšeng ka bophara ea Chemical Etching Method, ntle le liphello tse mpe tse bakoang ke ho khaola khatello ea kelello.

2. DO-218AB e na le bokhoni bo matla ba ho khutlela morao, ka lebaka la boholo ba chip ho feta bahlolisani ba eona.

3. Nako e tlaase ea ho lutla ho tloha moeling oa chip

4. TJ = 175 °C bokhoni bo loketseng ho tšepahala ho phahameng le tlhokahalo ea likoloi

5. Ho theoha ha matla a tlaase a pele

6. E kopana le litekanyetso tsa ho buuoa tsa ISO7637-2 (tse fapaneng ho ea ka boemo ba teko)

7. E kopana le boemo ba 1 ba MSL, ho ea ka J-STD-020, LF e phahameng ea tlhōrō ea 245 °C

DO-218AB
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Mehato ea Tlhahiso ea Chip

1. Ho Hatisa ka MechiniSuper- khatiso e nepahetseng ea sephaphatha)

2. Automatic Pele-etchingThepa ea Automatic Etching, CPK>1.67)

3. Teko e Ikemetseng ea Polarity (Teko e nepahetseng ea Polarity)

4. Kopano e Ikemetseng (Seboka se Iketselitseng Boithaopo)

5. Soldering (Ts'ireletso ka Motsoako oa Nitrogen & Hydrogen

Vacuum soldering)

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6. Ho eketsoa ha Bobeli ka ho iketsa (Automatic Second-etching with Ultra-pure Water)

7. Automatic Gluing (Uniform Gluing & Precise Calculation li Lemohuoa ka Automatic Precise Gluing Equipment)

8. Teko e Ikemetseng ea Thermal (Khetho e Ikemetseng ka Thermal Tester)

9. Teko e Ikemetseng (Teko e nang le Multifunctional)


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