Mount Mount Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM5S e tsitsitseng Haholo le e Tšepahalang
Lintlha tse matla tsa DO-218AB SM5S:
1. The chip ka hare e sebetsoa ke theknoloji e etellang pele lefatšeng ka bophara ea Chemical Etching Method, ntle le liphello tse mpe tse bakoang ke ho khaola khatello ea kelello.
2. DO-218AB e na le bokhoni bo matla ba ho khutlela morao, ka lebaka la boholo ba chip ho feta bahlolisani ba eona.
3. Nako e tlaase ea ho lutla ho tloha moeling oa chip
4. TJ = 175 °C bokhoni bo loketseng ho tšepahala ho phahameng le tlhokahalo ea likoloi
5. Ho theoha ha matla a tlaase a pele
6. E kopana le litekanyetso tsa ho buuoa tsa ISO7637-2 (tse fapaneng ho ea ka boemo ba teko)
7. E kopana le boemo ba 1 ba MSL, ho ea ka J-STD-020, LF e phahameng ea tlhōrō ea 245 °C
Mehato ea Tlhahiso ea Chip
1. Ho Hatisa ka Mechini(Super- khatiso e nepahetseng ea sephaphatha)
2. Automatic Pele-etching(Thepa ea Automatic Etching, CPK>1.67)
3. Teko e Ikemetseng ea Polarity (Teko e nepahetseng ea Polarity)
4. Kopano e Ikemetseng (Seboka se Iketselitseng Boithaopo)
5. Soldering (Ts'ireletso ka Motsoako oa Nitrogen & Hydrogen
Vacuum soldering)
6. Ho eketsoa ha Bobeli ka ho iketsa (Automatic Second-etching with Ultra-pure Water)
7. Automatic Gluing (Uniform Gluing & Precise Calculation li Lemohuoa ka Automatic Precise Gluing Equipment)
8. Teko e Ikemetseng ea Thermal (Khetho e Ikemetseng ka Thermal Tester)
9. Teko e Ikemetseng (Teko e nang le Multifunctional)