E Tšepahala Haholo ebile e iketselitse D2PAK (TO-263) SiC Diode

Setšoantšo se Tšepahalang Haholo le se Iketselitseng sa D2PAK (TO-263) SiC Diode

Tlhaloso e Khutšoanyane:

Sebopeho sa Liphutheloana: D2PAK (TO-263)

Selelekela: YUNYI D2PAK (TO-263) SiC Diode, e entsoeng ka thepa ea silicon carbide, e na le conductivity e phahameng ea mocheso, e ka ntlafatsang ka katleho matla a matla. Matla a phahameng a ts'ebetso ea SiC diode a eketsa matla a ho mamella le ho fokotsa boholo, 'me matla a maholo a ho senyeha ha elektroniki a eketsa matla a ho senyeha ha lisebelisoa tsa matla a semiconductor. Ka nako e ts'oanang, ka lebaka la ho eketseha ha matla a tšimo ea ho senyeha ha elektronike, tabeng ea ho eketsa ts'oaetso ea ho kenella ha litšila, "broadband" ea sebaka sa ho hoholeha ha sesebelisoa sa matla sa SiC diode se ka fokotsoa, e le hore boholo ba sesebelisoa sa matla se fokotsehe. e ka fokotsoa.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Ho beha leihlo nako ea karabo

Lekhalo la ho lekanya

Li-tag tsa Sehlahisoa

Melemo ea D2PAK ea YUNYI (TO-263) SiC Diode:

1. Inductance e tlaase

2. Litšenyehelo tsa tlhōlisano tse nang le boleng bo phahameng.

3. Ts'ebetso e phahameng ea tlhahiso e nang le nako e khutšoanyane ea nako.

4. Boholo bo nyane, bo thusa ho ntlafatsa sebaka sa boto ea potoloho

Mehato ea Tlhahiso ea Chip:

1. Ho Hatisa ka Mechini (Ho hatisa ka mokhoa o iketsahallang hantle haholo)

2. Mokhoa oa ho qala oa ho iketsetsa (Automatic Etching Equipment, CPK>1.67)

3. Teko e Ikemetseng ea Polarity (Teko e nepahetseng ea Polarity)

4. Kopano e Ikemetseng (Seboka se Iketselitseng Ka ho Fetisisa)

5. Soldering (Tshireletso le Motsoako oa Nitrogen & Hydrogen Vacuum Soldering)

6. Ho eketsoa ha Bobeli ka ho iketsa (Automatic Second-etching with Ultra-pure Water)

7. Mokhoa o Ikemetseng oa Gluing (Uniform Gluing & Precise Calculation li Lemohuoa ka Automatic Precise Gluing Equipment)

8. Teko e Ikemetseng ea Thermal (Khetho e Ikemetseng ka Thermal Tester)

9. Teko e Ikemetseng (Teko e nang le Multifunctional)

Parameters ea lihlahisoa:

Nomoro ea Karolo	Sephutheloana	VRWM V	IO A	IFZM A	IR μa	V_F V
ZICRB5650	D2PAK	650	5	60	60	2
ZICRB6650	D2PAK	650	6	60	50	2
Z3D06065G	D2PAK	650	6	70	3(0.03 e tloaelehileng)	1.7(1.5 e tloaelehileng)
ZICRB10650CT	D2PAK	650	10	60	60	1.7
ZICRB10650	D2PAK	650	10	110	100	1.7
Z3D10065G	D2PAK	650	10	115	40(0.7 e tloaelehileng)	1.7(1.45 e tloaelehileng)
ZICRB20650A	D2PAK	650	20	70	100	1.7
ZICRB101200	D2PAK	1200	10	110	100	1.8
ZICRB12600	D2PAK	600	12	50	150	1.7
ZICRB12650	D2PAK	650	12	50	150	1.7
Z3D30065G	D2PAK	650	30	255	140(4 e tloaelehileng)	1.7(1.4 e tloaelehileng)
Z4D05120G	D2PAK	1200	5	19	200(20 e tloaelehileng)	1.8(1.65 e tloaelehileng)
Z4D20120G	D2PAK	1200	20	162	200(35 e tloaelehileng)	1.8(1.5 e tloaelehileng)
Z3D20065G	D2PAK	650	20	170	50(1.5 e tloaelehileng)	1.7(1.45 e tloaelehileng)
Z3D06065L	DFN8×8	650.0	6.0	70.0	3(0.03 e tloaelehileng)	1.7(1.5 e tloaelehileng)