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High Thermal Conductivity DPAK (TO-252AA) SiC Diode

Tlhaloso e Khutšoanyane:

Sebopeho sa Pakete: DPAK (TO-252AA)

Selelekela: YUNYI DPAK (TO-252AA) SiC Diode, e entsoeng ka thepa ea silicon carbide, e na le conductivity e phahameng ea mocheso le matla a matla a ho fetisetsa mocheso, ho thusa ho ntlafatsa matla a matla a sesebelisoa sa matla, kahoo e loketse haholoanyane ho sebetsa sebakeng sa mocheso o phahameng. Matla a phahameng a ts'ebetso ea SiC diode a eketsa matla a ho mamella le ho fokotsa boholo, 'me matla a maholo a ho senyeha ha elektroniki a eketsa matla a ho senyeha ha lisebelisoa tsa matla a semiconductor. Ka nako e ts'oanang, ka lebaka la ho eketseha ha matla a tšimo ea ho senyeha ha elektronike, tabeng ea ho eketsa ts'oaetso ea ho kenella ha litšila, "broadband" ea sebaka sa ho hoholeha ha sesebelisoa sa matla sa SiC diode se ka fokotsoa, ​​​​e le hore boholo ba sesebelisoa sa matla se fokotsehe. e ka fokotsoa.


Lintlha tsa Sehlahisoa

Ho beha leihlo nako ea karabo

Lekhalo la ho lekanya

Li-tag tsa Sehlahisoa

Melemo ea DPAK ea YUNYI (TO-252AA) SiC Diode:

1. Litšenyehelo tsa tlhōlisano tse nang le boleng bo phahameng

2. Ts'ebetso e phahameng ea tlhahiso e nang le nako e khutšoanyane ea nako

3. Boholo bo nyane, bo thusa ho ntlafatsa sebaka sa boto ea potoloho

4. E tsitsitseng le e ka tšeptjoang tlas'a libaka tse sa tšoaneng tsa tlhaho

5. Chip e ikemetseng ea tahlehelo e tlase

HO TSA-252AA

Mekhoa ea ho hlahisa Chip:

1. Ho Hatisa ka Mechini (Ho hatisa ka mokhoa o iketsahallang ka mokhoa o hlakileng haholo)

2. Mokhoa oa ho qala oa ho iketsetsa (Automatic Etching Equipment, CPK>1.67)

3. Teko e Ikemetseng ea Polarity (Teko e nepahetseng ea Polarity)

4. Kopano e Ikemetseng (Seboka se Iketselitseng Ka ho Fetisisa)

5. Soldering (Tshireletso le Motsoako oa Nitrogen & Hydrogen Vacuum Soldering)

6. Ho eketsoa ha Bobeli ka ho iketsa (Automatic Second-etching with Ultra-pure Water)

7. Li-Gluing tse Ikemetseng (Uniform Gluing & Precise Calculation li Lemohuoa ka Automatic Precise Gluing Equipment)

8. Teko e Ikemetseng ea Thermal (Khetho e Ikemetseng ka Thermal Tester)

9. Teko e Ikemetseng (Teko e nang le Multifunctional)

贴片检测
芯片检测

Parameters ea lihlahisoa:

Nomoro ea Karolo Sephutheloana VRWM
V
IO
A
IFZM
A
IR
μa
VF
V
ZICRD5650 DPAK 650 5 60 60 2
ZICRD6650 DPAK 650 6 60 50 2
Z3D06065E DPAK 650 6 70 3(0.03 e tloaelehileng) 1.7(1.5 e tloaelehileng)
ZICRD10650CT DPAK 650 10 60 60 1.7
ZICRD10650 DPAK 650 10 110 100 1.7
ZICRD101200 DPAK 1200 10 110 100 1.8
ZICRD12600 DPAK 600 12 50 150 1.7
ZICRD12650 DPAK 650 12 50 150 1.7
Z3D03065E DPAK 650 3 46 2(0.03 e tloaelehileng) 1.7(1.4 e tloaelehileng)
Z3D10065E DPAK 650 10 115 40(0.7 e tloaelehileng) 1.7(1.45 e tloaelehileng)
Z4D04120E DPAK 1200 4 46 200(20 e tloaelehileng) 1.8(1.5 e tloaelehileng)
Z4D05120E DPAK 1200 5 46 200(20 e tloaelehileng) 1.8(1.65 e tloaelehileng)
Z4D02120E DPAK 1200 2 44 50(10 e tloaelehileng) 1.8(1.5 e tloaelehileng)
Z4D10120E DPAK 1200 10 105 200(30 e tloaelehileng) 1.8(1.5 e tloaelehileng)
Z4D08120E DPAK 1200 8 64 200(35 e tloaelehileng) 1.8(1.6 e tloaelehileng)
Z3D10065E2 DPAK 650 10 70( leoto ka leng) 8(0.002 e tloaelehileng)( leoto ka leng) 1.7(1.5 e tloaelehileng)( leoto ka leng)

 


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