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Mojule oa T1 oa Phepelo ea Matla a boleng bo holimo

Tlhaloso e Khutšoanyane:

Sephutheloana sa Sehlahisoa: T1

Selelekela: Foromo e tšesaane e phahameng ea hona joale ea ho paka, e sebelisa bohloeki bo phahameng, mocheso o phahameng oa mocheso oa epoxy bakeng sa ho paka, ho ntlafatsa matla a mochini le ho hanyetsa mongobo, ho matlafatsa nako e telele le ho ts'epahala haholo. E sebelisoa haholo ho fetola phepelo ea motlakase, converter, tšireletso ea khokahano ea betri ea anti reverse le lits'ebetso tse ling.


Lintlha tsa Sehlahisoa

Ho beha leihlo nako ea karabo

Lekhalo la ho lekanya

Li-tag tsa Sehlahisoa

Melemo ea YUNYI's Power Supply module T1:

1. Litšenyehelo tsa tlhōlisano tse nang le boleng bo phahameng.

2. Ts'ebetso e phahameng ea tlhahiso e nang le nako e khutšoanyane ea nako.

3. E tsitsitseng le e ka tšeptjoang tlas'a libaka tse sa tšoaneng tsa tlhaho.

4. Boholo bo nyane, bo thusa ho ntlafatsa sebaka sa boto ea potoloho

T1

Mekhoa ea ho hlahisa Chip:

1. Ho Hatisa ka Mechini (Ho hatisa ka mokhoa o iketsahallang hantle haholo)

2. Mokhoa oa ho qala oa ho iketsetsa (Automatic Etching Equipment, CPK>1.67)

3. Teko e Ikemetseng ea Polarity (Teko e nepahetseng ea Polarity)

4. Kopano e Ikemetseng (Seboka se Iketselitseng Ka ho Fetisisa)

5. Soldering (Tshireletso le Motsoako oa Nitrogen & Hydrogen Vacuum Soldering)

6. Ho eketsoa ha Bobeli ka ho iketsa (Automatic Second-etching with Ultra-pure Water)

7. Mokhoa o Ikemetseng oa Gluing (Uniform Gluing & Precise Calculation li Lemohuoa ka Automatic Precise Gluing Equipment)

8. Teko e Ikemetseng ea Thermal (Khetho e Ikemetseng ka Thermal Tester)

9. Teko e Ikemetseng (Teko e nang le Multifunctional)

芯片组装
芯片检测

Litlhophiso:

Nomoro ea Karolo Sephutheloana VRWM
V
IO
A
IFSM
A
IR
Ma
VF
V
Trr
ns
SM090KD800G1 T1 800 90 2000 0.02 1.05 -
SM090KE800G1 T1 800 90 2000 0.02 1.05 -
SM090KC800G1 T1 800 90 2000 0.02 1.05 -
SM090KJ800G1 T1 800 90 2000 0.02 1.05 -

 


  • E fetileng:
  • E 'ngoe:

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